Therefore, aluminum nitride as LED heat dissipation substrate is more mature and generally accepted at the present stage. However, due to the limitation, alN substrate is not suitable for the traditional thick film process (the material must undergo atmospheric heat treatment at 850℃ after printing with silver glue, which causes the material reliability problem). Therefore, aluminum nitride substrate circuit needs to be prepared in thin film process. The aluminum nitride substrate prepared by thin film process greatly accelerates the efficiency of heat transfer from LED grains through substrate material to system circuit board, thus greatly reducing the heat transfer from LED grains through metal wire to system circuit board, thus achieving the effect of high heat dissipation.

0.32 inch 3411AG LED Common-Cathode CC 3411AG 7-Segment digit 3411BG Display 3411BG Common-Anode CA
0.32 inch 3141AG LED Common-Cathode CC 3141AG 7-Segment digit 3141BG Display 3141BG Common-Anode CA

Electrode contact for LED heat dissipation
Aluminum nitride as LED heat dissipation substrate
LED thermal dispersion solutions
Ceramic heat dissipation substrate and LED luminous
LED grains heat substrate formed
Metal circuit layer for LED thermal dispersion
Film ceramic substrate is suitable for high power LED
Improve LED luminous efficiency by heat dissipation
Led cooling system
LED photoelectric conversion and heat dissipation