The eutectic/coating process combined with thin film ceramic heat dissipation substrate is bound to greatly improve the LED luminous power and product life. In recent years, due to the development of aluminum substrate, the heat dissipation of system circuit board is gradually improved, and even the flexible circuit board is gradually developed. On the other hand, LED grain substrate is also gradually towards the direction of reducing its thermal resistance. How to reduce the thermal resistance of LED crystal ceramic heat dissipation substrate is the most important topic to improve LED luminous efficiency. According to the manufacturing method of its circuit, it can be divided into thick film ceramic substrate, low temperature co-fired multilayer ceramic substrate and thin film ceramic substrate, which are described as follows.

0.32 inch 3412AB LED Common-Cathode CC 3412AB 7-Segment digit 3412BB Display 3412BB Common-Anode CA
0.32 inch 3411AB LED Common-Cathode CC 3411AB 7-Segment digit 3411BB Display 3411BB Common-Anode CA


Electrode contact for LED heat dissipation
Aluminum nitride as LED heat dissipation substrate
LED thermal dispersion solutions
Ceramic heat dissipation substrate and LED luminous
LED grains heat substrate formed
Metal circuit layer for LED thermal dispersion
Film ceramic substrate is suitable for high power LED
Improve LED luminous efficiency by heat dissipation
Led cooling system
LED photoelectric conversion and heat dissipation