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{"cards":[{"_id":"2664dec4b35eb2a1ee000033","treeId":"2664ded4b35eb2a1ee000031","seq":23039171,"position":1,"parentId":null,"content":"In recent years, the production technology of printed circuit board (PCB) has been very proficient, and the system circuit board of early LED products is mainly PCB. However, as the demand for high power LED increases, the material cooling capacity of PCB is limited, making it unable to be used in its high power products. In order to improve the heat dissipation problem of high power LED, high thermal conductivity aluminum substrate (MCPCB) has been developed recently, which has achieved the purpose of heat dissipation of high power products by using the better heat dissipation characteristics of metal materials. However, with the continuous development of LED brightness and efficiency requirements, although the system circuit board can effectively dissipate the heat generated by LED chips to the atmosphere, but the heat generated by LED grains can not effectively conduct from the grain to the system circuit board. \n\n0.32 inch <a href=\"http://www.xlitx.com/datasheet/3411AS.pdf\" style=\"color: #333;\">3411AS</a> LED Common-Cathode CC <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3411as.html\" style=\"color: #333;\">3411AS</a> 7-Segment digit <a href=\"http://www.xlitx.com/datasheet/3411BS.pdf\" style=\"color: #333;\">3411BS</a> Display <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3411bs.html\" style=\"color: #333;\">3411BS</a> Common-Anode CA\n0.32 inch <a href=\"http://www.xlitx.com/datasheet/3141AS.pdf\" style=\"color: #333;\">3141AS</a> LED Common-Cathode CC <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3141as.html\" style=\"color: #333;\">3141AS</a> 7-Segment digit <a href=\"http://www.xlitx.com/datasheet/3141BS.pdf\" style=\"color: #333;\">3141BS</a> Display <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3141bs.html\" style=\"color: #333;\">3141BS</a> Common-Anode CA\n\n<hr style=\"border:1px solid;\">\n\n<a href=\"https://gingkoapp.com/the-small-power-led-lamp-heat-dissipation.html\" style=\"color: #333;\">The small power LED lamp heat dissipation</a>\n<a href=\"https://gingkoapp.com/the-led-chip-can-not-be-directly-welded.html\" style=\"color: #333;\">The LED chip can not be directly welded</a>\n<a href=\"https://gingkoapp.com/heat-dissipation-material-improve-led-effect.html\" style=\"color: #333;\">Heat dissipation material improve LED effect</a>\n<a href=\"https://gingkoapp.com/the-role-of-led-module-structure.html\" style=\"color: #333;\">The role of LED module structure</a>\n<a href=\"https://gingkoapp.com/the-heat-generated-by-led-light.html\" style=\"color: #333;\">The heat generated by LED light</a>\n<a href=\"https://gingkoapp.com/led-grains-die-bonded-to-a-substrate.html\" style=\"color: #333;\">LED grains Die bonded to a Substrate</a>\n<a href=\"https://gingkoapp.com/led-heat-pass-through-the-electrode-metal.html\" style=\"color: #333;\">LED heat pass through the electrode metal</a>\n<a href=\"https://gingkoapp.com/led-heat-substrate-with-thermal-conductivity.html\" style=\"color: #333;\">LED heat substrate with thermal conductivity</a>\n<a href=\"https://gingkoapp.com/circuit-board-of-early-led-products.html\" style=\"color: #333;\">Circuit board of early LED products</a>\n<a href=\"https://gingkoapp.com/the-led-grain-substrate-is-a-medium.html\" style=\"color: #333;\">The LED grain substrate is a medium</a>"}],"tree":{"_id":"2664ded4b35eb2a1ee000031","name":"Circuit board of early LED products","publicUrl":"circuit-board-of-early-led-products"}}