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In recent years, the production technology of printed circuit board (PCB) has been very proficient, and the system circuit board of early LED products is mainly PCB. However, as the demand for high power LED increases, the material cooling capacity of PCB is limited, making it unable to be used in its high power products. In order to improve the heat dissipation problem of high power LED, high thermal conductivity aluminum substrate (MCPCB) has been developed recently, which has achieved the purpose of heat dissipation of high power products by using the better heat dissipation characteristics of metal materials. However, with the continuous development of LED brightness and efficiency requirements, although the system circuit board can effectively dissipate the heat generated by LED chips to the atmosphere, but the heat generated by LED grains can not effectively conduct from the grain to the system circuit board.

0.32 inch 3411AS LED Common-Cathode CC 3411AS 7-Segment digit 3411BS Display 3411BS Common-Anode CA
0.32 inch 3141AS LED Common-Cathode CC 3141AS 7-Segment digit 3141BS Display 3141BS Common-Anode CA


The small power LED lamp heat dissipation
The LED chip can not be directly welded
Heat dissipation material improve LED effect
The role of LED module structure
The heat generated by LED light
LED grains Die bonded to a Substrate
LED heat pass through the electrode metal
LED heat substrate with thermal conductivity
Circuit board of early LED products
The LED grain substrate is a medium