As mentioned in the introduction, this gold wire connection limits the efficiency of heat loss along the electrode contact for the LED heat dissipation, there are two solutions. One is to find substrate materials with high heat dissipation coefficient to replace alumina, including silicon substrate, silicon carbide substrate, anodized aluminum substrate or aluminum nitrous substrate. Among them, silicon and silicon carbide substrate material semiconductor characteristics, so that it is facing a severe test of LED heat dissipation at the present stage, and anodized aluminum substrate due to the strength of its anodized oxide layer is easy to lead due to fragmentation, so that it is limited in the practical application of LED heat dissipation.

0.32 inch 3421AG LED Common-Cathode CC 3421AG 7-Segment digit 3421BG Display 3421BG Common-Anode CA
0.32 inch 3412AG LED Common-Cathode CC 3412AG 7-Segment digit 3412BG Display 3412BG Common-Anode CA


Electrode contact for LED heat dissipation
Aluminum nitride as LED heat dissipation substrate
LED thermal dispersion solutions
Ceramic heat dissipation substrate and LED luminous
LED grains heat substrate formed
Metal circuit layer for LED thermal dispersion
Film ceramic substrate is suitable for high power LED
Improve LED luminous efficiency by heat dissipation
Led cooling system
LED photoelectric conversion and heat dissipation