The use of yellow microfilm process, so that the circuit on the substrate more accurate; The metal circuit is not easy to fall off, so the thin film ceramic substrate is suitable for high power, small size, high brightness LED, and eutectic, coating packaging process that requires high alignment accuracy. The development trend of LED products can be seen from the observation of the power and size of LED products published by LED packaging manufacturers recently. It can be seen that high-power and small-size products are the development focus of LED industry, and all use ceramic heat dissipation substrate as the way of heat dissipation of LED grains. Therefore, ceramic heat dissipation substrate in high power, small size LED product structure, has become a very important part.

0.32 inch 3411AGG LED Common-Cathode CC 3411AGG 7-Segment digit 3411BGG Display 3411BGG Common-Anode CA
0.32 inch 3141AGG LED Common-Cathode CC 3141AGG 7-Segment digit 3141BGG Display 3141BGG Common-Anode CA

Electrode contact for LED heat dissipation
Aluminum nitride as LED heat dissipation substrate
LED thermal dispersion solutions
Ceramic heat dissipation substrate and LED luminous
LED grains heat substrate formed
Metal circuit layer for LED thermal dispersion
Film ceramic substrate is suitable for high power LED
Improve LED luminous efficiency by heat dissipation
Led cooling system
LED photoelectric conversion and heat dissipation