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When the temperature exceeds a certain value, the device failure rate increases exponentially. Statistics show that reliability decreases by 10% for every 2℃ increase in component temperature. The heat dissipation problem is more serious when multiple leds are densely packed to form a white light lighting system. Solving heat management problems has become a prerequisite for high brightness LED applications. For the relation between chip size and heat dissipation, the most direct way to improve the brightness of power LED is to increase the input power, and the size of p-N junction must be increased accordingly to prevent the saturation of active layer. With the increase of input power, the junction temperature will rise and the quantum efficiency will decrease.

0.32 inch CL3231AB LED Common-Cathode CC CL3231AB 7-Segment digit CL3231BB Display CL3231BB Common-Anode CA
0.32 inch 3312AB LED Common-Cathode CC 3312AB 7-Segment digit 3312BB Display 3312BB Common-Anode CA

LED load voltage must be lower
LED brightness low-key with reduced voltage
Different LEDs with current and output curves
The working ratio change LED brightness
LED heat dissipation technology
LED lamp work is stable
Heat management with high brightness LED
Heat dissipation for highlight LED
LED device to extract heat from P-N junction
LED Lamp surface radiation heat treatment