To improve the LED luminous efficiency and service life of LED products heat dissipation problem is one of the most important subject at this stage, the development of LED industry also is the high power, high brightness, small size LED products as its development focus, therefore, with its high heat resistance, precision size heat dissipation base board, also become the development trend of the future in LED heat dissipation substrate. At this stage, aluminum nitride substrate instead of alumina substrate, or eutectic or cladding process, instead of gold line grain/substrate combination to improve LED luminous efficiency for the development of mainstream. Under this development trend, the line alignment accuracy of the heat dissipation substrate itself is very strict, and it needs to have high heat dissipation, small size, good adhesion of metal circuit and other characteristics. Therefore, the production of thin film ceramic heat dissipation substrate using yellow light microfilm will become one of the important catalysts to promote the continuous high power improvement of LED.

0.32 inch 3241AW LED Common-Cathode CC 3241AW 7-Segment digit 3241BW Display 3241BW Common-Anode CA
0.32 inch 3421AW LED Common-Cathode CC 3421AW 7-Segment digit 3421BW Display 3421BW Common-Anode CA


Electrode contact for LED heat dissipation
Aluminum nitride as LED heat dissipation substrate
LED thermal dispersion solutions
Ceramic heat dissipation substrate and LED luminous
LED grains heat substrate formed
Metal circuit layer for LED thermal dispersion
Film ceramic substrate is suitable for high power LED
Improve LED luminous efficiency by heat dissipation
Led cooling system
LED photoelectric conversion and heat dissipation