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{"cards":[{"_id":"2664ee25b35eb2a1ee000027","treeId":"2664ee34b35eb2a1ee000025","seq":23039174,"position":1,"parentId":null,"content":"In general, LED grains (Die) are bonded to a Substrate of LED Die in a metal-forming, eutectic, or cladding manner to form a LED chip, which is then fixed to the System circuit board. Therefore, the possible way of LED heat dissipation is directly from the air, or through the LED grain substrate to the system circuit board and then to the atmospheric environment. The rate of heat dissipation from the system circuit board to the atmosphere depends on the design of the luminescent lamp or system. However, the heat dissipation bottleneck of the whole system at present mainly occurs in the heat conduction from LED grain to its substrate and then to the system circuit board. This part of the possible heat dissipation path: one is directly through the grain substrate heat dissipation to the system circuit board, in this heat dissipation path, the LED grain substrate material thermal dispersion capacity is a very important parameter.\n\n0.30 inch <a href=\"http://www.xlitx.com/datasheet/3301APG.pdf\" style=\"color: #333;\">3301APG</a> LED Common-Cathode CC <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3301apg.html\" style=\"color: #333;\">3301APG</a> 7-Segment digit <a href=\"http://www.xlitx.com/datasheet/3301BPG.pdf\" style=\"color: #333;\">3301BPG</a> Display <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3301bpg.html\" style=\"color: #333;\">3301BPG</a> Common-Anode CA\n0.30 inch <a href=\"http://www.xlitx.com/datasheet/3301AW.pdf\" style=\"color: #333;\">3301AW</a> LED Common-Cathode CC <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3301aw.html\" style=\"color: #333;\">3301AW</a> 7-Segment digit <a href=\"http://www.xlitx.com/datasheet/3301BW.pdf\" style=\"color: #333;\">3301BW</a> Display <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3301bw.html\" style=\"color: #333;\">3301BW</a> Common-Anode CA\n\n<hr style=\"border:1px solid;\">\n\n<a href=\"https://gingkoapp.com/the-small-power-led-lamp-heat-dissipation.html\" style=\"color: #333;\">The small power LED lamp heat dissipation</a>\n<a href=\"https://gingkoapp.com/the-led-chip-can-not-be-directly-welded.html\" style=\"color: #333;\">The LED chip can not be directly welded</a>\n<a href=\"https://gingkoapp.com/heat-dissipation-material-improve-led-effect.html\" style=\"color: #333;\">Heat dissipation material improve LED effect</a>\n<a href=\"https://gingkoapp.com/the-role-of-led-module-structure.html\" style=\"color: #333;\">The role of LED module structure</a>\n<a href=\"https://gingkoapp.com/the-heat-generated-by-led-light.html\" style=\"color: #333;\">The heat generated by LED light</a>\n<a href=\"https://gingkoapp.com/led-grains-die-bonded-to-a-substrate.html\" style=\"color: #333;\">LED grains Die bonded to a Substrate</a>\n<a href=\"https://gingkoapp.com/led-heat-pass-through-the-electrode-metal.html\" style=\"color: #333;\">LED heat pass through the electrode metal</a>\n<a href=\"https://gingkoapp.com/led-heat-substrate-with-thermal-conductivity.html\" style=\"color: #333;\">LED heat substrate with thermal conductivity</a>\n<a href=\"https://gingkoapp.com/circuit-board-of-early-led-products.html\" style=\"color: #333;\">Circuit board of early LED products</a>\n<a href=\"https://gingkoapp.com/the-led-grain-substrate-is-a-medium.html\" style=\"color: #333;\">The LED grain substrate is a medium</a>"}],"tree":{"_id":"2664ee34b35eb2a1ee000025","name":"LED grains Die bonded to a Substrate","publicUrl":"led-grains-die-bonded-to-a-substrate"}}