In general, LED grains (Die) are bonded to a Substrate of LED Die in a metal-forming, eutectic, or cladding manner to form a LED chip, which is then fixed to the System circuit board. Therefore, the possible way of LED heat dissipation is directly from the air, or through the LED grain substrate to the system circuit board and then to the atmospheric environment. The rate of heat dissipation from the system circuit board to the atmosphere depends on the design of the luminescent lamp or system. However, the heat dissipation bottleneck of the whole system at present mainly occurs in the heat conduction from LED grain to its substrate and then to the system circuit board. This part of the possible heat dissipation path: one is directly through the grain substrate heat dissipation to the system circuit board, in this heat dissipation path, the LED grain substrate material thermal dispersion capacity is a very important parameter.

0.30 inch 3301APG LED Common-Cathode CC 3301APG 7-Segment digit 3301BPG Display 3301BPG Common-Anode CA
0.30 inch 3301AW LED Common-Cathode CC 3301AW 7-Segment digit 3301BW Display 3301BW Common-Anode CA

The small power LED lamp heat dissipation
The LED chip can not be directly welded
Heat dissipation material improve LED effect
The role of LED module structure
The heat generated by LED light
LED grains Die bonded to a Substrate
LED heat pass through the electrode metal
LED heat substrate with thermal conductivity
Circuit board of early LED products
The LED grain substrate is a medium