The thick film ceramic substrate is produced by screen printing technology. The material is printed on the substrate with a scraper. After drying, sintering, laser and other steps, the heat dissipation substrate of LED grains is formed. Generally speaking, the line made by screen printing is easy to produce rough lines and inaccurate counterpoint because of the problem of screen plate. Therefore, the accuracy of thick film ceramic substrate has gradually failed to meet the requirements of high-power LED products with smaller and smaller sizes and finer lines in the future, as well as LED products with accurate eutectic or cladding processes. Low-temperature co-firing multi-layer ceramic technology, with ceramic as substrate material, the circuit is printed on the substrate by screen printing, and then the multi-layer ceramic substrate is integrated, and finally the heat dissipation substrate of LED grain is formed through low-temperature sintering.

0.32 inch 3141AB LED Common-Cathode CC 3141AB 7-Segment digit 3141BB Display 3141BB Common-Anode CA
0.32 inch 3241AGG LED Common-Cathode CC 3241AGG 7-Segment digit 3241BGG Display 3241BGG Common-Anode CA

Electrode contact for LED heat dissipation
Aluminum nitride as LED heat dissipation substrate
LED thermal dispersion solutions
Ceramic heat dissipation substrate and LED luminous
LED grains heat substrate formed
Metal circuit layer for LED thermal dispersion
Film ceramic substrate is suitable for high power LED
Improve LED luminous efficiency by heat dissipation
Led cooling system
LED photoelectric conversion and heat dissipation