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{"cards":[{"_id":"2664e898b35eb2a1ee00002b","treeId":"2664e8a9b35eb2a1ee000029","seq":23039173,"position":1,"parentId":null,"content":"The other is that the heat generated by the LED will also pass through the electrode metal wire to the system circuit board. Generally speaking, the heat dissipation of the metal wire is limited by the slender geometry of the metal wire itself. Thus, more recently, Eutectic or Flip Chip joints have been developed, which greatly reduce the wire length and greatly increase the cross-sectional area of the wire, thus improving the heat dissipation efficiency of the LED electrode wire to the system circuit board. Through the explanation of the above heat dissipation way, it can be known that the choice of heat dissipation substrate material and the packaging mode of LED grain play a very important role in LED heat dissipation management. We will make a brief description for LED heat dissipation substrate.\n\n0.30 inch <a href=\"http://www.xlitx.com/datasheet/3031AW.pdf\" style=\"color: #333;\">3031AW</a> LED Common-Cathode CC <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3031aw.html\" style=\"color: #333;\">3031AW</a> 7-Segment digit <a href=\"http://www.xlitx.com/datasheet/3031BW.pdf\" style=\"color: #333;\">3031BW</a> Display <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3031bw.html\" style=\"color: #333;\">3031BW</a> Common-Anode CA\n0.32 inch <a href=\"http://www.xlitx.com/datasheet/3241AS.pdf\" style=\"color: #333;\">3241AS</a> LED Common-Cathode CC <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3241as.html\" style=\"color: #333;\">3241AS</a> 7-Segment digit <a href=\"http://www.xlitx.com/datasheet/3241BS.pdf\" style=\"color: #333;\">3241BS</a> Display <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3241bs.html\" style=\"color: #333;\">3241BS</a> Common-Anode CA\n\n<hr style=\"border:1px solid;\">\n\n<a href=\"https://gingkoapp.com/the-small-power-led-lamp-heat-dissipation.html\" style=\"color: #333;\">The small power LED lamp heat dissipation</a>\n<a href=\"https://gingkoapp.com/the-led-chip-can-not-be-directly-welded.html\" style=\"color: #333;\">The LED chip can not be directly welded</a>\n<a href=\"https://gingkoapp.com/heat-dissipation-material-improve-led-effect.html\" style=\"color: #333;\">Heat dissipation material improve LED effect</a>\n<a href=\"https://gingkoapp.com/the-role-of-led-module-structure.html\" style=\"color: #333;\">The role of LED module structure</a>\n<a href=\"https://gingkoapp.com/the-heat-generated-by-led-light.html\" style=\"color: #333;\">The heat generated by LED light</a>\n<a href=\"https://gingkoapp.com/led-grains-die-bonded-to-a-substrate.html\" style=\"color: #333;\">LED grains Die bonded to a Substrate</a>\n<a href=\"https://gingkoapp.com/led-heat-pass-through-the-electrode-metal.html\" style=\"color: #333;\">LED heat pass through the electrode metal</a>\n<a href=\"https://gingkoapp.com/led-heat-substrate-with-thermal-conductivity.html\" style=\"color: #333;\">LED heat substrate with thermal conductivity</a>\n<a href=\"https://gingkoapp.com/circuit-board-of-early-led-products.html\" style=\"color: #333;\">Circuit board of early LED products</a>\n<a href=\"https://gingkoapp.com/the-led-grain-substrate-is-a-medium.html\" style=\"color: #333;\">The LED grain substrate is a medium</a>"}],"tree":{"_id":"2664e8a9b35eb2a1ee000029","name":"LED heat pass through the electrode metal","publicUrl":"led-heat-pass-through-the-electrode-metal"}}