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The other is that the heat generated by the LED will also pass through the electrode metal wire to the system circuit board. Generally speaking, the heat dissipation of the metal wire is limited by the slender geometry of the metal wire itself. Thus, more recently, Eutectic or Flip Chip joints have been developed, which greatly reduce the wire length and greatly increase the cross-sectional area of the wire, thus improving the heat dissipation efficiency of the LED electrode wire to the system circuit board. Through the explanation of the above heat dissipation way, it can be known that the choice of heat dissipation substrate material and the packaging mode of LED grain play a very important role in LED heat dissipation management. We will make a brief description for LED heat dissipation substrate.

0.30 inch 3031AW LED Common-Cathode CC 3031AW 7-Segment digit 3031BW Display 3031BW Common-Anode CA
0.32 inch 3241AS LED Common-Cathode CC 3241AS 7-Segment digit 3241BS Display 3241BS Common-Anode CA

The small power LED lamp heat dissipation
The LED chip can not be directly welded
Heat dissipation material improve LED effect
The role of LED module structure
The heat generated by LED light
LED grains Die bonded to a Substrate
LED heat pass through the electrode metal
LED heat substrate with thermal conductivity
Circuit board of early LED products
The LED grain substrate is a medium