Another LED thermal dispersion solution is to connect LED grains to the substrate in eutectic or overcrystal mode, which greatly increases the heat dissipation efficiency through electrode wires to the system circuit board. However, the LED heat dissipation process has very high requirements for substrate wiring accuracy and substrate line surface flatness, which makes the precision of thick film and low temperature co-fired ceramic substrate not meet the requirements of use due to the problems of plate opening and sintering shrinkage ratio in the process. At present, thin film ceramic substrate is introduced to solve the LED heat dissipation problem. Thin film ceramic substrate is used to prepare the circuit in the way of yellow light and microshade, supplemented by electroplating or electroless plating to increase the thickness of the circuit, so that the product has the characteristics of high precision and high flatness of the circuit.

0.32 inch 3241AB LED Common-Cathode CC 3241AB 7-Segment digit 3241BB Display 3241BB Common-Anode CA
0.32 inch 3421AB LED Common-Cathode CC 3421AB 7-Segment digit 3421BB Display 3421BB Common-Anode CA


Electrode contact for LED heat dissipation
Aluminum nitride as LED heat dissipation substrate
LED thermal dispersion solutions
Ceramic heat dissipation substrate and LED luminous
LED grains heat substrate formed
Metal circuit layer for LED thermal dispersion
Film ceramic substrate is suitable for high power LED
Improve LED luminous efficiency by heat dissipation
Led cooling system
LED photoelectric conversion and heat dissipation