The metal circuit layer of the low temperature co-fired multilayer ceramic substrate for LED thermal dispersion is also made by the net printing process, which may also cause the alignment error due to the net stretching problem. In addition, the shrinkage ratio of the multilayer ceramic after the laminated sintering will also be considered. Therefore, it will be more stringent if low-temperature co-fired multilayer ceramics are used in eutectic and cladding LED products that require precise alignment of lines. Thin film ceramic substrate was developed as the heat dissipation substrate of LED grains in order to improve the problem of mesh opening in thick film process and shrinkage ratio after multilayer laminated sintering. Thin film heat dissipation substrate is made by spatter plating, electric and electrochemical deposition, as well as yellow photomicrography process, low temperature process (below 300℃), to avoid the possibility of high temperature material damage or size variation.
0.32 inch 3421AGG LED Common-Cathode CC 3421AGG 7-Segment digit 3421BGG Display 3421BGG Common-Anode CA
0.32 inch 3412AGG LED Common-Cathode CC 3412AGG 7-Segment digit 3412BGG Display 3412BGG Common-Anode CA
Electrode contact for LED heat dissipation
Aluminum nitride as LED heat dissipation substrate
LED thermal dispersion solutions
Ceramic heat dissipation substrate and LED luminous
LED grains heat substrate formed
Metal circuit layer for LED thermal dispersion
Film ceramic substrate is suitable for high power LED
Improve LED luminous efficiency by heat dissipation
Led cooling system
LED photoelectric conversion and heat dissipation