Sign up for free to use this document yourself.

  • Optical, electro-optical, metals, semiconductor, compound semiconductor and ceramic materials as a gentle stock removal pad or a final polishing pad. HARDNESS (Scale C): 55 - 60 COMPRESSION %: 11-13% DENSITY: 0.383-0.468 g/cm3 THICKNESS: 0.050.
    metal polishing pads

{"cards":[{"_id":"4286c0a35889bbb2a0000015","treeId":"4286c0ba5889bbb2a0000013","seq":21810801,"position":1,"parentId":null,"content":"Optical, electro-optical, metals, semiconductor, compound semiconductor and ceramic materials as a gentle stock removal pad or a final polishing pad. HARDNESS (Scale C): 55 - 60 COMPRESSION %: 11-13% DENSITY: 0.383-0.468 g/cm3 THICKNESS: 0.050.\n<a href=\"https://spartanfelt.com/metal-polishing-pads/\">metal polishing pads</a>"}],"tree":{"_id":"4286c0ba5889bbb2a0000013","name":"metal polishing pads","publicUrl":"metal-polishing-pads"}}