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{"cards":[{"_id":"2664f1b7b35eb2a1ee000023","treeId":"2664f1c8b35eb2a1ee000021","seq":23039175,"position":1,"parentId":null,"content":"Generally speaking, if the heat generated by LED light cannot be exported, it will make the LED junction surface temperature too high, which will affect the product life cycle, luminous efficiency, stability. Therefore, in order to improve the LED luminous efficiency, the heat dissipation management and design of LED system has become an important topic. Before understanding the LED heat dissipation problem, we must first understand its heat dissipation way, and then improve the heat dissipation bottleneck. According to different LED packaging technology, its heat dissipation method is also different, Heat dissipation path description: Heat dissipation from air can be directly exported from the System circuit board and through the gold wire. In the case of eutectic and Flip chip manufacturing process, heat will be exported from the through hole to the System circuit board.\n\n0.30 inch <a href=\"http://www.xlitx.com/datasheet/3301AGG.pdf\" style=\"color: #333;\">3301AGG</a> LED Common-Cathode CC <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3301agg.html\" style=\"color: #333;\">3301AGG</a> 7-Segment digit <a href=\"http://www.xlitx.com/datasheet/3301BGG.pdf\" style=\"color: #333;\">3301BGG</a> Display <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3301bgg.html\" style=\"color: #333;\">3301BGG</a> Common-Anode CA\n0.30 inch <a href=\"http://www.xlitx.com/datasheet/3031AGG.pdf\" style=\"color: #333;\">3031AGG</a> LED Common-Cathode CC <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3031agg.html\" style=\"color: #333;\">3031AGG</a> 7-Segment digit <a href=\"http://www.xlitx.com/datasheet/3031BGG.pdf\" style=\"color: #333;\">3031BGG</a> Display <a href=\"http://www.lanpade.com/7-segment-led-dot-matrix/3031bgg.html\" style=\"color: #333;\">3031BGG</a> Common-Anode CA\n\n<hr style=\"border:1px solid;\">\n\n<a href=\"https://gingkoapp.com/the-small-power-led-lamp-heat-dissipation.html\" style=\"color: #333;\">The small power LED lamp heat dissipation</a>\n<a href=\"https://gingkoapp.com/the-led-chip-can-not-be-directly-welded.html\" style=\"color: #333;\">The LED chip can not be directly welded</a>\n<a href=\"https://gingkoapp.com/heat-dissipation-material-improve-led-effect.html\" style=\"color: #333;\">Heat dissipation material improve LED effect</a>\n<a href=\"https://gingkoapp.com/the-role-of-led-module-structure.html\" style=\"color: #333;\">The role of LED module structure</a>\n<a href=\"https://gingkoapp.com/the-heat-generated-by-led-light.html\" style=\"color: #333;\">The heat generated by LED light</a>\n<a href=\"https://gingkoapp.com/led-grains-die-bonded-to-a-substrate.html\" style=\"color: #333;\">LED grains Die bonded to a Substrate</a>\n<a href=\"https://gingkoapp.com/led-heat-pass-through-the-electrode-metal.html\" style=\"color: #333;\">LED heat pass through the electrode metal</a>\n<a href=\"https://gingkoapp.com/led-heat-substrate-with-thermal-conductivity.html\" style=\"color: #333;\">LED heat substrate with thermal conductivity</a>\n<a href=\"https://gingkoapp.com/circuit-board-of-early-led-products.html\" style=\"color: #333;\">Circuit board of early LED products</a>\n<a href=\"https://gingkoapp.com/the-led-grain-substrate-is-a-medium.html\" style=\"color: #333;\">The LED grain substrate is a medium</a>"}],"tree":{"_id":"2664f1c8b35eb2a1ee000021","name":"The heat generated by LED light","publicUrl":"the-heat-generated-by-led-light"}}