The LED chip can not be directly welded, so as to avoid high and low temperature thermal stress damage the LED chip. The latest high thermal conductivity ceramic material, thermal conductivity close to aluminum, expansion system can be adjusted to synchronize with LED chip. In this way, the heat conduction and heat dissipation can be integrated and the intermediate link of heat conduction can be reduced. LED heat dissipation technology breakthrough, the existing LED ceiling hole lights mostly use aluminum with fins as radiator. The heat dissipation effect of this radiator is not ideal, and the radiator usually reaches a higher temperature. The use of insulation heat dissipation plastic, instead of aluminum alloy heat dissipation body, South Korea has developed a LED biological thermal conductivity plastic, in maintaining heat dissipation capacity and aluminum alloy at the same time, so that the thermal radiation capacity improved 4-8 times.

0.32 inch 3312AW LED Common-Cathode CC 3312AW 7-Segment digit 3312BW Display 3312BW Common-Anode CA
0.32 inch 3311AW LED Common-Cathode CC 3311AW 7-Segment digit 3311BW Display 3311BW Common-Anode CA

The small power LED lamp heat dissipation
The LED chip can not be directly welded
Heat dissipation material improve LED effect
The role of LED module structure
The heat generated by LED light
LED grains Die bonded to a Substrate
LED heat pass through the electrode metal
LED heat substrate with thermal conductivity
Circuit board of early LED products
The LED grain substrate is a medium