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In other words, when the LED power to more efficient improvement, the entire LED heat dissipation bottleneck will appear in the LED crystal heat dissipation substrate. The LED grain substrate is mainly used as a medium for thermal exportation between LED grains and the system circuit board, and is combined with LED grains by wiring, eutectic or cladding processes. Based on heat dissipation considerations, ceramic substrate is the main LED grain substrate on the market, which can be roughly divided into three types: thick film ceramic substrate, low-temperature co-fired multi-layer ceramics, and thin film ceramic substrate. In the traditional high power LED components, the thick film or low temperature co-firing ceramic substrate is used as the crystal heat dissipation substrate, and then the LED grain is combined with the ceramic substrate in the way of gold wire.

0.32 inch CL3241AH LED Common-Cathode CC CL3241AH 7-Segment digit CL3241BH Display CL3241BH Common-Anode CA
0.32 inch 3241AG LED Common-Cathode CC 3241AG 7-Segment digit 3241BG Display 3241BG Common-Anode CA


The small power LED lamp heat dissipation
The LED chip can not be directly welded
Heat dissipation material improve LED effect
The role of LED module structure
The heat generated by LED light
LED grains Die bonded to a Substrate
LED heat pass through the electrode metal
LED heat substrate with thermal conductivity
Circuit board of early LED products
The LED grain substrate is a medium